Management of exterior temperatures encountered by user of a portable     electronic device

ABSTRACT

Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes a proximity sensor configured to determine a location of a user touch to the shell relative to the location of the heat-rejection element. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the determined location of the user touch relative to the location of the heat-rejection element.

If an Application Data Sheet (ADS) has been filed on the filing date ofthis application, it is incorporated by reference herein. Anyapplications claimed on the ADS for priority under 35 U.S.C. §§119, 120,121, or 365(c), and any and all parent, grandparent, great-grandparent,etc. applications of such applications, are also incorporated byreference, including any priority claims made in those applications andany material incorporated by reference, to the extent such subjectmatter is not inconsistent herewith.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is related to and/or claims the benefit of theearliest available effective filing date(s) from the following listedapplication(s) (the “Priority Applications”), if any, listed below(e.g., claims earliest available priority dates for other thanprovisional patent applications or claims benefits under 35 USC §119(e)for provisional patent applications, for any and all parent,grandparent, great-grandparent, etc. applications of the PriorityApplication(s)). In addition, the present application is related to the“Related Applications,” if any, listed below.

Priority Applications:

None.

Related Applications:

U.S. patent application Ser. No. ______, entitled MANAGEMENT OF EXTERIORTEMPERATURES ENCOUNTERED BY USER OF A PORTABLE ELECTRONIC DEVICE INRESPONSE TO AN INFERRED USER CONTACT WITH THE PORTABLE ELECTRONICDEVICE, naming Philip L. Barnes, Hon Wah Chin, Howard L. Davidson,Kimberly D. A. Hallman, Roderick A. Hyde, Muriel Y. Ishikawa, Jordin T.Kare, Brian Lee, Richard T. Lord, Robert W. Lord, Craig J. Mundie,Nathan P. Myhrvold, Nicholas F. Pasch, Eric D. Rudder, Clarence T.Tegreene, Marc Tremblay, David B. Tuckerman, Charles Whitmer, and LowellL. Wood, Jr. as inventors, filed 13 Mar. 2013 with attorney docket no.1012-006-002-000000, is related to the present application.

U.S. patent application Ser. No. ______, entitled MANAGEMENT OF EXTERIORTEMPERATURES ENCOUNTERED BY USER OF A PORTABLE ELECTRONIC DEVICE USINGMULTIPLE HEAT-REJECTION ELEMENTS, naming Philip L. Barnes, Hon Wah Chin,Howard L. Davidson, Kimberly D. A. Hallman, Roderick A. Hyde, Muriel Y.Ishikawa, Jordin T. Kare, Brian Lee, Richard T. Lord, Robert W. Lord,Craig J. Mundie, Nathan P. Myhrvold, Nicholas F. Pasch, Eric D. Rudder,Clarence T. Tegreene, Marc Tremblay, David B. Tuckerman, CharlesWhitmer, and Lowell L. Wood, Jr. as inventors, filed 13 Mar. 2013 withattorney docket no. 1012-006-003-000000, is related to the presentapplication.

U.S. patent application Ser. No. ______, entitled MANAGEMENT OF EXTERIORTEMPERATURES ENCOUNTERED BY USER OF A PORTABLE ELECTRONIC DEVICE BYREDUCING HEAT GENERATION BY A COMPONENT, naming Philip L. Barnes, HonWah Chin, Howard L. Davidson, Kimberly D. A. Hallman, Roderick A. Hyde,Muriel Y. Ishikawa, Jordin T. Kare, Brian Lee, Richard T. Lord, RobertW. Lord, Craig J. Mundie, Nathan P. Myhrvold, Nicholas F. Pasch, Eric D.Rudder, Clarence T. Tegreene, Marc Tremblay, David B. Tuckerman, CharlesWhitmer, and Lowell L. Wood, Jr. as inventors, filed 13 Mar. 2013 withattorney docket no. 1012-006-004-000000, is related to the presentapplication.

The United States Patent Office (USPTO) has published a notice to theeffect that the USPTO's computer programs require that patent applicantsreference both a serial number and indicate whether an application is acontinuation, continuation-in-part, or divisional of a parentapplication. Stephen G. Kunin, Benefit of Prior-Filed Application, USPTOOfficial Gazette Mar. 18, 2003. The USPTO further has provided forms forthe Application Data Sheet which allow automatic loading ofbibliographic data but which require identification of each applicationas a continuation, continuation-in-part, or divisional of a parentapplication. The present Applicant Entity (hereinafter “Applicant”) hasprovided above a specific reference to the application(s) from whichpriority is being claimed as recited by statute. Applicant understandsthat the statute is unambiguous in its specific reference language anddoes not require either a serial number or any characterization, such as“continuation” or “continuation-in-part,” for claiming priority to U.S.patent applications. Notwithstanding the foregoing, Applicantunderstands that the USPTO's computer programs have certain data entryrequirements, and hence Applicant has provided designation(s) of arelationship between the present application and its parentapplication(s) as set forth above and in any ADS filed in thisapplication, but expressly points out that such designation(s) are notto be construed in any way as any type of commentary and/or admission asto whether or not the present application contains any new matter inaddition to the matter of its parent application(s).

If the listings of applications provided above are inconsistent with thelistings provided via an ADS, it is the intent of the Applicant to claimpriority to each application that appears in the Priority Applicationssection of the ADS and to each application that appears in the PriorityApplications section of this application.

All subject matter of the Priority Applications and the RelatedApplications and of any and all parent, grandparent, great-grandparent,etc. applications of the Priority Applications and the RelatedApplications, including any priority claims, is incorporated herein byreference to the extent such subject matter is not inconsistentherewith.

SUMMARY

For example, and without limitation, an embodiment of the subject matterdescribed herein includes a portable electronic device. The portableelectronic device includes a shell housing components of the portableelectronic device having a heat-generating component. The portableelectronic device includes a heat-rejection element located at anexterior surface of the shell, the heat-rejection element configured toreject heat received from the heat-generating component into anenvironment in thermal contact with the heat-rejection element. Theportable electronic device includes a controllable thermal couplerconfigured to regulate heat transfer to the heat-rejection element. Theportable electronic device includes a proximity sensor configured todetermine a location of a user touch to the shell relative to thelocation of the heat-rejection element. The portable electronic deviceincludes a thermal manager configured to regulate heat transfer by thecontrollable thermal coupler to the heat-rejection element in responseto the determined location of the user touch relative to the location ofthe heat-rejection element.

In an embodiment, the controllable thermal coupler further includes aheat-collecting element configured to absorb heat generated by theheat-generating component. In an embodiment, the portable electronicdevice further includes a temperature sensor configured to determine atemperature of the shell or the heat-rejection element.

For example, and without limitation, an embodiment of the subject matterdescribed herein includes a method of limiting exterior temperaturesencountered by a user of a portable electronic device housed by a shell.The method includes determining a location of a user touch to the shellrelative to a location of a heat-rejection element located at anexterior surface of the shell. The heat-rejection element is configuredto reject heat received from a heat-generating component of theelectronic device into an environment in thermal contact with theheat-rejection element. The method includes selecting a heat rejectionstrategy responsive to the determined location of the user touchrelative to the location of the heat-rejection element. The methodincludes regulating heat transfer from the heat-generating component tothe heat-rejection element in accordance with the selectedheat-rejection strategy.

For example, and without limitation, an embodiment of the subject matterdescribed herein includes a system for limiting exterior temperaturesencountered by a user of a portable electronic device. The systemincludes means for determining if a location of a user touch to a shellof the portable electronic device relative to a location of aheat-rejection element located at an exterior surface of the shell iswithin a zone of possible heat discomfort. The heat-rejection element isconfigured to reject heat received from a heat-generating component ofthe portable electronic device into an environment in thermal contactwith the heat-rejection element. The system includes means for selectinga heat rejection strategy responsive to the determined location of theuser touch within a zone of possible heat discomfort. The systemincludes means for limiting a heat transfer from the heat-generatingcomponent of the portable electronic device to the heat-rejectionelement in accordance with the selected heat-rejection strategy.

The foregoing summary is illustrative only and is not intended to be inany way limiting. In addition to the illustrative aspects, embodiments,and features described above, further aspects, embodiments, and featureswill become apparent by reference to the drawings and the followingdetailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example embodiment of a thin computing device inwhich embodiments may be implemented;

FIG. 2 illustrates an example embodiment of a general-purpose computingsystem in which embodiments may be implemented;

FIG. 3 illustrates an example environment 200 in which embodiments maybe implemented;

FIG. 4 further illustrates a schematic view of the embodiment of theportable electronic device of FIG. 3;

FIG. 5, including FIGS. 5A and 5B, illustrates an embodiment where theheat-rejection element of FIG. 4 includes a 6×4 array of heat-rejectionelements;

FIG. 6 illustrates an example operational flow 600 implemented in aportable electronic device having a shell and heat-generating component;

FIG. 7 illustrates a portable electronic device having a system 700 forlimiting exterior temperatures encountered by a user of a portableelectronic device;

FIG. 8 illustrates an example portable electronic device 805 havingsystem for limiting exterior temperatures encountered by a user of theportable electronic device;

FIG. 9 illustrates an example operational flow 900 implemented in aportable electronic device having an exterior shell and aheat-generating component;

FIG. 10 illustrates a portable electronic device having a system 1000for limiting exterior temperatures encountered by a user of the portableelectronic device;

FIG. 11 illustrates a portable electronic device 1105;

FIG. 12 illustrates an example operational flow 1200 limiting exteriortemperatures encountered by a user of a portable electronic devicehaving an exterior shell and a heat generating component;

FIG. 13 illustrates an example system 1300 for limiting exteriortemperatures encountered by a user of a portable electronic device;

FIG. 14 illustrates an example environment 1400 in which embodiments maybe implemented;

FIG. 15 further illustrates a schematic view of the embodiment of theportable electronic device 1405 of FIG. 14;

FIG. 16 illustrates an example operational flow 1500 implemented in aportable electronic device having an exterior shell and aheat-generating component; and

FIG. 17 illustrates an example operational flow 1600 implemented in aportable electronic device having a shell and a heat-generatingcomponent.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof. In the drawings,similar symbols typically identify similar components, unless contextdictates otherwise. The illustrated embodiments described in thedetailed description, drawings, and claims are not meant to be limiting.Other embodiments may be utilized, and other changes may be made,without departing from the spirit or scope of the subject matterpresented here.

Those having skill in the art will recognize that the state of the arthas progressed to the point where there is little distinction leftbetween hardware, software, and/or firmware implementations of aspectsof systems; the use of hardware, software, and/or firmware is generally(but not always, in that in certain contexts the choice between hardwareand software can become significant) a design choice representing costvs. efficiency tradeoffs. Those having skill in the art will appreciatethat there are various implementations by which processes and/or systemsand/or other technologies described herein can be effected (e.g.,hardware, software, and/or firmware), and that the preferredimplementation will vary with the context in which the processes and/orsystems and/or other technologies are deployed. For example, if animplementer determines that speed and accuracy are paramount, theimplementer may opt for a mainly hardware and/or firmwareimplementation; alternatively, if flexibility is paramount, theimplementer may opt for a mainly software implementation; or, yet againalternatively, the implementer may opt for some combination of hardware,software, and/or firmware. Hence, there are several possibleimplementations by which the processes and/or devices and/or othertechnologies described herein may be effected, none of which isinherently superior to the other in that any implementation to beutilized is a choice dependent upon the context in which theimplementation will be deployed and the specific concerns (e.g., speed,flexibility, or predictability) of the implementer, any of which mayvary. Those skilled in the art will recognize that optical aspects ofimplementations will typically employ optically-oriented hardware,software, and or firmware.

In some implementations described herein, logic and similarimplementations may include software or other control structuressuitable to implement an operation. Electronic circuitry, for example,may manifest one or more paths of electrical current constructed andarranged to implement various logic functions as described herein. Insome implementations, one or more media are configured to bear adevice-detectable implementation if such media hold or transmit aspecial-purpose device instruction set operable to perform as describedherein. In some variants, for example, this may manifest as an update orother modification of existing software or firmware, or of gate arraysor other programmable hardware, such as by performing a reception of ora transmission of one or more instructions in relation to one or moreoperations described herein. Alternatively or additionally, in somevariants, an implementation may include special-purpose hardware,software, firmware components, and/or general-purpose componentsexecuting or otherwise invoking special-purpose components.Specifications or other implementations may be transmitted by one ormore instances of tangible transmission media as described herein,optionally by packet transmission or otherwise by passing throughdistributed media at various times.

Alternatively or additionally, implementations may include executing aspecial-purpose instruction sequence or otherwise invoking circuitry forenabling, triggering, coordinating, requesting, or otherwise causing oneor more occurrences of any functional operations described below. Insome variants, operational or other logical descriptions herein may beexpressed directly as source code and compiled or otherwise invoked asan executable instruction sequence. In some contexts, for example, C++or other code sequences can be compiled directly or otherwiseimplemented in high-level descriptor languages (e.g., alogic-synthesizable language, a hardware description language, ahardware design simulation, and/or other such similar mode(s) ofexpression). Alternatively or additionally, some or all of the logicalexpression may be manifested as a Verilog-type hardware description orother circuitry model before physical implementation in hardware,especially for basic operations or timing-critical applications. Thoseskilled in the art will recognize how to obtain, configure, and optimizesuitable transmission or computational elements, material supplies,actuators, or other common structures in light of these teachings.

In a general sense, those skilled in the art will recognize that thevarious embodiments described herein can be implemented, individuallyand/or collectively, by various types of electro-mechanical systemshaving a wide range of electrical components such as hardware, software,firmware, and/or virtually any combination thereof; and a wide range ofcomponents that may impart mechanical force or motion such as rigidbodies, spring or torsional bodies, hydraulics, electro-magneticallyactuated devices, and/or virtually any combination thereof.Consequently, as used herein “electro-mechanical system” includes, butis not limited to, electrical circuitry operably coupled with atransducer (e.g., an actuator, a motor, a piezoelectric crystal, a MicroElectro Mechanical System (MEMS), etc.), electrical circuitry having atleast one discrete electrical circuit, electrical circuitry having atleast one integrated circuit, electrical circuitry having at least oneapplication specific integrated circuit, electrical circuitry forming ageneral purpose computing device configured by a computer program (e.g.,a general purpose computer configured by a computer program which atleast partially carries out processes and/or devices described herein,or a microprocessor configured by a computer program which at leastpartially carries out processes and/or devices described herein),electrical circuitry forming a memory device (e.g., forms of memory(e.g., random access, flash, read only, etc.)), electrical circuitryforming a communications device (e.g., a modem, module, communicationsswitch, optical-electrical equipment, etc.), and/or any non-electricalanalog thereto, such as optical or other analogs. Those skilled in theart will also appreciate that examples of electro-mechanical systemsinclude but are not limited to a variety of consumer electronicssystems, medical devices, as well as other systems such as motorizedtransport systems, factory automation systems, security systems, and/orcommunication/computing systems. Those skilled in the art will recognizethat electro-mechanical as used herein is not necessarily limited to asystem that has both electrical and mechanical actuation except ascontext may dictate otherwise.

In a general sense, those skilled in the art will also recognize thatthe various aspects described herein which can be implemented,individually and/or collectively, by a wide range of hardware, software,firmware, and/or any combination thereof can be viewed as being composedof various types of “electrical circuitry.” Consequently, as used herein“electrical circuitry” includes, but is not limited to, electricalcircuitry having at least one discrete electrical circuit, electricalcircuitry having at least one integrated circuit, electrical circuitryhaving at least one application specific integrated circuit, electricalcircuitry forming a general purpose computing device configured by acomputer program (e.g., a general purpose computer configured by acomputer program which at least partially carries out processes and/ordevices described herein, or a microprocessor configured by a computerprogram which at least partially carries out processes and/or devicesdescribed herein), electrical circuitry forming a memory device (e.g.,forms of memory (e.g., random access, flash, read only, etc.)), and/orelectrical circuitry forming a communications device (e.g., a modem,communications switch, optical-electrical equipment, etc.). Those havingskill in the art will recognize that the subject matter described hereinmay be implemented in an analog or digital fashion or some combinationthereof.

Those skilled in the art will further recognize that at least a portionof the devices and/or processes described herein can be integrated intoan image processing system. A typical image processing system maygenerally include one or more of a system unit housing, a video displaydevice, memory such as volatile or non-volatile memory, processors suchas microprocessors or digital signal processors, computational entitiessuch as operating systems, drivers, applications programs, one or moreinteraction devices (e.g., a touch pad, a touch-sensitive screen ordisplay surface, an antenna, etc.), control systems including feedbackloops and control motors (e.g., feedback for sensing lens positionand/or velocity; control motors for moving/distorting lenses to givedesired focuses). An image processing system may be implementedutilizing suitable commercially available components, such as thosetypically found in digital still systems and/or digital motion systems.

Those skilled in the art will likewise recognize that at least some ofthe devices and/or processes described herein can be integrated into adata processing system. Those having skill in the art will recognizethat a data processing system generally includes one or more of a systemunit housing, a video display device, memory such as volatile ornon-volatile memory, processors such as microprocessors or digitalsignal processors, computational entities such as operating systems,drivers, graphical user interfaces, and applications programs, one ormore interaction devices (e.g., a touch pad, a touch-sensitive screen ordisplay surface, an antenna, etc.), and/or control systems includingfeedback loops and control motors (e.g., feedback for sensing positionand/or velocity; control motors for moving and/or adjusting componentsand/or quantities). A data processing system may be implementedutilizing suitable commercially available components, such as thosetypically found in data computing/communication and/or networkcomputing/communication systems.

FIGS. 1 and 2 provide respective general descriptions of severalenvironments in which implementations may be implemented. FIG. 1 isgenerally directed toward a thin computing environment 19 having a thincomputing device 20, and FIG. 2 is generally directed toward a generalpurpose computing environment 100 having general purpose computingdevice 110. However, as prices of computer components drop and ascapacity and speeds increase, there is not always a bright line betweena thin computing device and a general purpose computing device. Further,there is a continuous stream of new ideas and applications forenvironments benefited by use of computing power. As a result, nothingshould be construed to limit disclosed subject matter herein to aspecific computing environment unless limited by express language.

FIG. 1 and the following discussion are intended to provide a brief,general description of a thin computing environment 19 in whichembodiments may be implemented. FIG. 1 illustrates an example systemthat includes a thin computing device 20, which may be included orembedded in an electronic device that also includes a device functionalelement 50. For example, the electronic device may include any itemhaving electrical or electronic components playing a role in afunctionality of the item, such as for example, a refrigerator, a car, adigital image acquisition device, a camera, a cable modem, a printer anultrasound device, an x-ray machine, a non-invasive imaging device, oran airplane. For example, the electronic device may include any itemthat interfaces with or controls a functional element of the item. Inanother example, the thin computing device may be included in animplantable medical apparatus or device. In a further example, the thincomputing device may be operable to communicate with an implantable orimplanted medical apparatus. For example, a thin computing device mayinclude a computing device having limited resources or limitedprocessing capability, such as a limited resource computing device, awireless communication device, a mobile wireless communication device, asmart phone, an electronic pen, a handheld electronic writing device, ascanner, a cell phone, a smart phone (such as an Android® or iPhone®based device), a tablet device (such as an iPad®) or a Blackberry®device. For example, a thin computing device may include a thin clientdevice or a mobile thin client device, such as a smart phone, tablet,notebook, or desktop hardware configured to function in a virtualizedenvironment.

The thin computing device 20 includes a processing unit 21, a systemmemory 22, and a system bus 23 that couples various system componentsincluding the system memory 22 to the processing unit 21. The system bus23 may be any of several types of bus structures including a memory busor memory controller, a peripheral bus, and a local bus using any of avariety of bus architectures. The system memory includes read-onlymemory (ROM) 24 and random access memory (RAM) 25. A basic input/outputsystem (BIOS) 26, containing the basic routines that help to transferinformation between sub-components within the thin computing device 20,such as during start-up, is stored in the ROM 24. A number of programmodules may be stored in the ROM 24 or RAM 25, including an operatingsystem 28, one or more application programs 29, other program modules30, and program data 31.

A user may enter commands and information into the computing device 20through one or more input interfaces. An input interface may include atouch-sensitive screen or display surface, or one or more switches orbuttons with suitable input detection circuitry. A touch-sensitivescreen or display surface is illustrated as a touch-sensitive display 32and screen input detector 33. One or more switches or buttons areillustrated as hardware buttons 44 connected to the system via ahardware button interface 45. The output circuitry of thetouch-sensitive display 32 is connected to the system bus 23 via a videodriver 37. Other input devices may include a microphone 34 connectedthrough a suitable audio interface 35, or a physical hardware keyboard(not shown). Output devices may include the display 32, or a projectordisplay 36.

In addition to the display 32, the computing device 20 may include otherperipheral output devices, such as at least one speaker 38. Otherexternal input or output devices 39, such as a joystick, game pad,satellite dish, scanner or the like may be connected to the processingunit 21 through a USB port 40 and USB port interface 41, to the systembus 23. Alternatively, the other external input and output devices 39may be connected by other interfaces, such as a parallel port, game portor other port. The computing device 20 may further include or be capableof connecting to a flash card memory (not shown) through an appropriateconnection port (not shown). The computing device 20 may further includeor be capable of connecting with a network through a network port 42 andnetwork interface 43, and through wireless port 46 and correspondingwireless interface 47 may be provided to facilitate communication withother peripheral devices, including other computers, printers, and so on(not shown). It will be appreciated that the various components andconnections shown are examples and other components and means ofestablishing communication links may be used.

The computing device 20 may be primarily designed to include a userinterface. The user interface may include a character, a key-based, oranother user data input via the touch sensitive display 32. The userinterface may include using a stylus (not shown). Moreover, the userinterface is not limited to an actual touch-sensitive panel arranged fordirectly receiving input, but may alternatively or in addition respondto another input device such as the microphone 34. For example, spokenwords may be received at the microphone 34 and recognized.Alternatively, the computing device 20 may be designed to include a userinterface having a physical keyboard (not shown).

The device functional elements 50 are typically application specific andrelated to a function of the electronic device, and are coupled with thesystem bus 23 through an interface (not shown). The functional elementsmay typically perform a single well-defined task with little or no userconfiguration or setup, such as a refrigerator keeping food cold, a cellphone connecting with an appropriate tower and transceiving voice ordata information, a camera capturing and saving an image, orcommunicating with an implantable medical apparatus.

In certain instances, one or more elements of the thin computing device20 may be deemed not necessary and omitted. In other instances, one ormore other elements may be deemed necessary and added to the thincomputing device.

FIG. 2 and the following discussion are intended to provide a brief,general description of an environment in which embodiments may beimplemented. FIG. 2 illustrates an example embodiment of ageneral-purpose computing system in which embodiments may beimplemented, shown as a computing system environment 100. Components ofthe computing system environment 100 may include, but are not limitedto, a general purpose computing device 110 having a processor 120, asystem memory 130, and a system bus 121 that couples various systemcomponents including the system memory to the processor 120. The systembus 121 may be any of several types of bus structures including a memorybus or memory controller, a peripheral bus, and a local bus using any ofa variety of bus architectures. By way of example, and not limitation,such architectures include Industry Standard Architecture (ISA) bus,Micro Channel Architecture (MCA) bus, Enhanced ISA (EISA) bus, VideoElectronics Standards Association (VESA) local bus, and PeripheralComponent Interconnect (PCI) bus, also known as Mezzanine bus.

The computing system environment 100 typically includes a variety ofcomputer-readable media products. Computer-readable media may includeany media that can be accessed by the computing device 110 and includeboth volatile and nonvolatile media, removable and non-removable media.By way of example, and not of limitation, computer-readable media mayinclude computer storage media. By way of further example, and not oflimitation, computer-readable media may include a communication media.

Computer storage media includes volatile and nonvolatile, removable andnon-removable media implemented in any method or technology for storageof information such as computer-readable instructions, data structures,program modules, or other data. Computer storage media includes, but isnot limited to, random-access memory (RAM), read-only memory (ROM),electrically erasable programmable read-only memory (EEPROM), flashmemory, or other memory technology, CD-ROM, digital versatile disks(DVD), or other optical disk storage, magnetic cassettes, magnetic tape,magnetic disk storage, or other magnetic storage devices, or any othermedium which can be used to store the desired information and which canbe accessed by the computing device 110. In a further embodiment, acomputer storage media may include a group of computer storage mediadevices. In another embodiment, a computer storage media may include aninformation store. In another embodiment, an information store mayinclude a quantum memory, a photonic quantum memory, or atomic quantummemory. Combinations of any of the above may also be included within thescope of computer-readable media.

Communication media may typically embody computer-readable instructions,data structures, program modules, or other data in a modulated datasignal such as a carrier wave or other transport mechanism and includeany information delivery media. The term “modulated data signal” means asignal that has one or more of its characteristics set or changed insuch a manner as to encode information in the signal. By way of example,and not limitation, communications media may include wired media, suchas a wired network and a direct-wired connection, and wireless mediasuch as acoustic, RF, optical, and infrared media.

The system memory 130 includes computer storage media in the form ofvolatile and nonvolatile memory such as ROM 131 and RAM 132. A RAM mayinclude at least one of a DRAM, an EDO DRAM, a SDRAM, a RDRAM, a VRAM,or a DDR DRAM. A basic input/output system (BIOS) 133, containing thebasic routines that help to transfer information between elements withinthe computing device 110, such as during start-up, is typically storedin ROM 131. RAM 132 typically contains data and program modules that areimmediately accessible to or presently being operated on by theprocessor 120. By way of example, and not limitation, FIG. 2 illustratesan operating system 134, application programs 135, other program modules136, and program data 137. Often, the operating system 134 offersservices to applications programs 135 by way of one or more applicationprogramming interfaces (APIs) (not shown). Because the operating system134 incorporates these services, developers of applications programs 135need not redevelop code to use the services. Examples of APIs providedby operating systems such as Microsoft's “WINDOWS” ® are well known inthe art.

The computing device 110 may also include other removable/non-removable,volatile/nonvolatile computer storage media products. By way of exampleonly, FIG. 2 illustrates a non-removable non-volatile memory interface(hard disk interface) 140 that reads from and writes for example tonon-removable, non-volatile magnetic media. FIG. 2 also illustrates aremovable non-volatile memory interface 150 that, for example, iscoupled to a magnetic disk drive 151 that reads from and writes to aremovable, non-volatile magnetic disk 152, or is coupled to an opticaldisk drive 155 that reads from and writes to a removable, non-volatileoptical disk 156, such as a CD ROM. Other removable/non-removable,volatile/non-volatile computer storage media that can be used in theexample operating environment include, but are not limited to, magnetictape cassettes, memory cards, flash memory cards, DVDs, digital videotape, solid state RAM, and solid state ROM. The hard disk drive 141 istypically connected to the system bus 121 through a non-removable memoryinterface, such as the interface 140, and magnetic disk drive 151 andoptical disk drive 155 are typically connected to the system bus 121 bya removable non-volatile memory interface, such as interface 150.

The drives and their associated computer storage media discussed aboveand illustrated in FIG. 2 provide storage of computer-readableinstructions, data structures, program modules, and other data for thecomputing device 110. In FIG. 2, for example, hard disk drive 141 isillustrated as storing an operating system 144, application programs145, other program modules 146, and program data 147. Note that thesecomponents can either be the same as or different from the operatingsystem 134, application programs 135, other program modules 136, andprogram data 137. The operating system 144, application programs 145,other program modules 146, and program data 147 are given differentnumbers here to illustrate that, at a minimum, they are differentcopies.

A user may enter commands and information into the computing device 110through input devices such as a microphone 163, keyboard 162, andpointing device 161, commonly referred to as a mouse, trackball, ortouch pad. Other input devices (not shown) may include at least one of atouch-sensitive screen or display surface, joystick, game pad, satellitedish, and scanner. These and other input devices are often connected tothe processor 120 through a user input interface 160 that is coupled tothe system bus, but may be connected by other interface and busstructures, such as a parallel port, game port, or a universal serialbus (USB).

A display 191, such as a monitor or other type of display device orsurface may be connected to the system bus 121 via an interface, such asa video interface 190. A projector display engine 192 that includes aprojecting element may be coupled to the system bus. In addition to thedisplay, the computing device 110 may also include other peripheraloutput devices such as speakers 197 and printer 196, which may beconnected through an output peripheral interface 195.

The computing system environment 100 may operate in a networkedenvironment using logical connections to one or more remote computers,such as a remote computer 180. The remote computer 180 may be a personalcomputer, a server, a router, a network PC, a peer device, or othercommon network node, and typically includes many or all of the elementsdescribed above relative to the computing device 110, although only amemory storage device 181 has been illustrated in FIG. 2. The networklogical connections depicted in FIG. 2 include a local area network(LAN) and a wide area network (WAN), and may also include other networkssuch as a personal area network (PAN) (not shown). Such networkingenvironments are commonplace in offices, enterprise-wide computernetworks, intranets, and the Internet.

When used in a networking environment, the computing system environment100 is connected to the network 171 through a network interface, such asthe network interface 170, the modem 172, or the wireless interface 193.The network may include a LAN network environment, or a WAN networkenvironment, such as the Internet. In a networked environment, programmodules depicted relative to the computing device 110, or portionsthereof, may be stored in a remote memory storage device. By way ofexample, and not limitation, FIG. 2 illustrates remote applicationprograms 185 as residing on memory storage device 181. It will beappreciated that the network connections shown are examples and othermeans of establishing a communication link between the computers may beused.

In certain instances, one or more elements of the computing device 110may be deemed not necessary and omitted. In other instances, one or moreother elements may be deemed necessary and added to the computingdevice.

FIG. 3 illustrates an example environment 200 in which embodiments maybe implemented. The environment includes an embodiment of a portableelectronic device 205, and a user of the portable electronic device,illustrated as a person 290 having a hand 292 capable of touching,holding, or contacting the electronic device. FIG. 4 further illustratesa schematic view of the embodiment of the portable electronic device ofFIG. 3. This portion of the detailed description will employ both FIGS.3 and 4 to describe the portable electronic device.

The portable electronic device 205 includes a shell 210 housing thecomponents of portable electronic device, and a heat-generatingcomponent 215 generating heat 216. The portable electronic deviceincludes a heat-rejection element 222 located at a first exteriorsurface 212 of the shell. The heat-rejecting 222 element is configuredto reject heat 223 received from the heat-generating component 215 intoan environment 298 in thermal contact with the heat-rejection element.In an embodiment, the environment 298 includes an external or ambientenvironment in thermal contact with the heat-rejection element. In anembodiment, the environment 298 includes an external or ambientenvironment in thermal contact with the heat-rejection element and theshell. The portable electronic device includes a controllable thermalcoupler 230 configured to regulate heat transfer to the heat-rejectionelement. In an embodiment, the controllable thermal coupler includes acontrol element 232 configured to physically or mechanically accomplishthe regulation of heat transfer, illustrated by heat 234 and heat 235transferring or flowing from the heat-generating component to theheat-rejection element. The portable electronic device includes a firstproximity sensor 242 configured to determine a location 245 of a usertouch 249 to the shell relative to the location of the heat-rejectionelement. In an embodiment, the user touch 249 may involve the hand ofthe user (e.g., fingers, palm). In an embodiment, the user touch 249 mayinvolve other portions of the user's body or clothing (e.g., when thedevice is held on a lap, or is inside a pocket). The first proximitysensor has a proximity 243 to the heat-rejection element. The portableelectronic device includes a thermal manager 250 configured to regulateheat transfer 235 by the controllable thermal coupler to theheat-rejection element in response to the determined location of theuser touch relative to the location of the heat-rejection element. In anembodiment, the thermal manager may be implemented using electroniccircuitry, a special-purpose device, electro-mechanical device orsystem, or control structure suitable to implement the describedconfiguration or operability. Alternatively or additionally, in somevariants of the thermal manager, an implementation may includespecial-purpose hardware, software, firmware components, and/orgeneral-purpose components executing or otherwise invokingspecial-purpose components. In an embodiment, the portable electronicdevice includes a second exterior surface 214.

For example, in use, heat transfer 235 to the heat-rejection element 222is controlled by or turned off by the controllable thermal coupler 230in response to the location of the user touch 249 being close to orwithin a zone 270 of possible heat discomfort relative of theheat-rejection element. This is anticipated to limit user exposure to ahot or uncomfortably warm heat-rejection element. What is too close orwithin a zone of possible heat discomfort relative of the heat-rejectionelement is expected to vary depending on the configuration or featuresof the particular portable electronic device 205, and possibly the user.In the example illustrated by FIG. 4, the user touch is on the same side212 of the portable electronic device as the heat-rejection element.This may be determined by the thermal manager 250 as too close to theheat-rejection element based on the configuration or features of theparticular portable electronic device, and accordingly heat transfer tothe heat-rejection element reduced or terminated. For example, in use,heat transfer to the heat-rejection element is initiated or continued bycontrollable thermal coupler in response to the location of the usertouch being distant from or outside a zone of possible heat discomfortrelative from the heat-rejection element. This is anticipated to provideheat rejection and allow cooling of the portable electronic devicewithout burning or causing heat discomfort.

In an embodiment, the portable electronic device 205 may be implementedusing the thin computing device 20 described in conjunction with FIG. 1.In an embodiment, the portable electronic device may be implementedusing the general computing device 110 described in conjunction withFIG. 2. In an embodiment, the portable electronic device includes a cellphone or a smart phone. In an embodiment, the portable electronic deviceincludes a tablet, laptop computer, or music player. In an embodiment,the shell 210 includes a hand-holdable shell. In an embodiment, theshell includes a cover substantially enclosing the portable electronicdevice having the heat-generating component. In an embodiment, the shellincludes a cover that in combination with a display screen 286 that atleast substantially encloses a portable electronic device having aheat-generating component. In an embodiment, the heat-generatingcomponent 215 includes a CPU. In an embodiment, the heat-generatingcomponent includes a battery. In an embodiment, the heat-generatingcomponent creates a variable or varying heat output during anoperational cycle.

In an embodiment, the heat-rejection element 222 is disposed on oroccupies an exterior portion of the shell 210. In an embodiment, theheat-rejection element is disposed on or occupies an exterior portion ofthe shell at a first location. In an embodiment, the heat-rejectionelement includes an opening through the shell which is exposed to anexternal or ambient environment in thermal contact with the shell. In anembodiment, the heat-rejection element is integrated with an exteriorportion of the shell. In an embodiment, the heat-rejection element isconfigured to reject heat received from the heat-generating componentinto ambient air environment 298 in thermal contact with the shell. Forexample, an ambient air environment may include air surrounding orproximate to the shell. In an embodiment, the portable electronic deviceincludes another heat-rejection element 224.

In an embodiment, the heat-rejection element 222 is configured to rejectheat received from the heat-generating component 215 into a heatsinkable external object in thermal contact with the shell 210. Forexample, a heat sinkable external object may include a table top,counter top, or dashboard. FIG. 5 illustrates an embodiment where theheat-rejection element 222 of FIG. 4 includes a 6×4 array ofheat-rejection elements 226. Heat transfer to at least twoheat-rejection elements of the array of heat-rejection elements isseparately controllable by the controllable thermal coupler 230. Forexample, the array may be located on a backside of the portablecomputing device 205. FIG. 5A illustrates an embodiment where all of theheat-rejection elements of the array are receiving heat 235 from theheat-rejecting component 215 and rejecting the received heat into theenvironment 298. For example, FIG. 5B illustrates a user touch 249 to aportion of the surface area occupied by four heat-rejection elements ofthe array. In this example, the thermal manager 250 is configured tooperate the controllable thermal coupler 230 to reduce or terminate heattransfer to the four heat-rejection elements of the array 249,illustrated by the four blackened heat-rejection elements in FIG. 5B. Inan embodiment, at least two heat-rejection elements of the array ofheat-rejection elements are separately controllable by the controllablethermal coupler. In an embodiment, at least two heat-rejection elementsof the array of heat-rejection elements are separately controllable bythe controllable thermal coupler.

In an embodiment, the controllable thermal coupler 230 is configured toseparately transfer heat 235 to a plurality of different spatiallocations of the heat-rejection element 222. For example, theheat-rejection element may include a condenser portion of a heat pipe orheat plate running substantially parallel to a portion of shell andinterior of the shell. The heat-rejection element includes a pluralityof controllable thermal contacts disposed along the length or area ofthe heat pipe and configured to be separately controlled in response tothe determined location of the user touch relative to the heat-rejectionelement. For example, this embodiment may be located on a back portionof the shell.

Returning to FIGS. 3 and 4, in an embodiment, the heat-rejection element222 includes a piezoelectric fan assembly. An example of a piezoelectricfan assembly is described in U.S. Pat. App. No. 20040253130 (I. Sauciuc,et al.). In an embodiment, the heat-rejection element includescontrollable fin assembly. For example, the controllable fin assemblymay include fins having a controllable orientation or extension. In anembodiment, the controllable thermal coupler 230 includes a controllablemicrochannel heat exchanger having a heat-rejection element. In anembodiment, the controllable microchannel heat exchanger includes amicrochanneled heat sink having a control valve configured to regulateflow of a working fluid through the microchannels. An example of acontrollable microchannel heat exchanger is described in in U.S. Pat.App. No. 20050117300 (R. Prasher, et al.).

In an embodiment, the controllable thermal coupler 230 includes acontrollable pump or valve, illustrated by the control element 232,configured to regulate transfer of a working fluid flowing between aheat-collecting element 238 and the heat-rejection element 222. In anembodiment, the controllable thermal coupler includes a controllablethermal contact, illustrated by the control element 232, between theheat-rejection element and the heat-generating component. In anembodiment, the controllable thermal contact comprises a repositionablethermally conductive solid. In an embodiment, the controllable thermalcontact comprises a repositionable thermally conductive fluid. In anembodiment, the controllable thermal contact comprises a repositionablephase change material. In an embodiment, the controllable thermalcontact includes a controllable mechanical contact, illustrated by thecontrol element 232, between the heat-rejection element and theheat-generating component. For example, the controllable mechanicalcontact may include a spring, a bimorph, or a piezoelectric activatedbridging device. For example, the controllable thermal contact mayinclude a bridging fluid. In an embodiment, the controllable thermalcoupler is further configured to control flow of a working fluid throughthe heat-rejection element. In an embodiment, the controllable thermalcoupler is further configured to insert into or remove a working fluidfrom the heat-rejection element. In an embodiment, the controllablethermal coupler is further configured to control a thermally conductivephysical contact between the heat-rejection element and theheat-generating component. In an embodiment, the controllable thermalcoupler includes a controllable pump or valve configured to regulatetransfer of a flowing working fluid. In an embodiment, theheat-rejection element is a component of the controllable thermalcoupler.

In an embodiment, the controllable thermal coupler 230 further includesa heat-collecting element 238 configured to absorb heat 216 generated bythe heat-generating component 215. In an embodiment, the controllablethermal coupler includes a controllable pump or valve, illustrated bythe control element 232, configured to regulate transfer of a workingfluid flowing between the heat-collecting element and the heat-rejectionelement. In an embodiment, the controllable thermal contact comprises arepositionable thermally conductive solid. In an embodiment, thecontrollable thermal contact comprises a repositionable thermallyconductive fluid. In an embodiment, the controllable thermal contactcomprises a repositionable phase change material. In an embodiment, thecontrollable thermal coupler includes a controllable thermal contactbetween the heat-rejection element and the heat-collecting element. Inan embodiment, the controllable thermal coupler includes a controllablemechanical contact between the heat-rejection element and theheat-collecting element. In an embodiment, wherein the controllablethermal coupler is further configured to control a flow of a workingfluid between the heat-rejection element and the heat-collectingelement. In an embodiment, the controllable thermal coupler is furtherconfigured to control a thermally conductive physical contact betweenthe heat-rejection element and the heat-collecting element. In anembodiment, the controllable thermal coupler includes a controllablethermal contact between the heat-generating component and theheat-collecting element. In an embodiment, the controllable thermalcontact comprises a repositionable thermally conductive solid. In anembodiment, the controllable thermal contact comprises a repositionablethermally conductive fluid. In an embodiment, the controllable thermalcontact comprises a repositionable phase change material. In anembodiment, the controllable thermal coupler includes a controllablemechanical contact between the heat-generating component and theheat-collecting element. In an embodiment, the controllable thermalcoupler is further configured to control a flow of a working fluidbetween the heat-generating component and the heat-collecting element.In an embodiment, the controllable thermal coupler is further configuredto control a thermally conductive physical contact between theheat-generating component and the heat-collecting element.

In an embodiment, the controllable thermal coupler 230 includes aworking fluid control portion of a controllable heat pipe or heat platepositioned between an evaporator portion, illustrated as by theheat-collecting element 238, and a condenser portion, illustrated by theheat-rejection element 222. For example, the control element 232 mayinclude a valve, switch, diverter, or baffle.

In an embodiment, the proximity sensor 242 is configured to determine alocation of a user touch 249 on the shell 210 relative 245 to thelocation of the heat-rejection element 222. In an embodiment, theproximity sensor is configured to determine if a location of a usertouch to the shell relative to the location of the heat-rejectionelement is within a zone 270 of possible heat discomfort. In anembodiment, the proximity sensor is configured to determine a locationof a user touch to the shell relative to the location of theheat-rejection element. In an embodiment, the proximity sensor isconfigured to determine a distance between a user touch on the shell andthe heat-rejection element. In an embodiment, the proximity sensor islocated on or within the shell. In an embodiment, the proximity sensoris located on or within a portion of the shell that is a distance 245 ofless than about 25 mm from the location of the heat-rejection element onthe shell. In an embodiment, the distance is less than about 10 mm. Inan embodiment, the proximity sensor is configured to determine alocation and duration of a user touch to the shell relative to thelocation of the heat-rejection element. In an embodiment, the proximitysensor includes an ultrasound based proximity sensor. In an embodiment,the proximity sensor includes a radiofrequency (RF) based proximitysensor. A radiofrequency based proximity sensor may include radar, suchas a micro-impulse radar. A radiofrequency based proximity sensor maycomprise a dielectric scattering sensor, e.g., determining userproximity based on changes to an RF antenna's performance due to thedielectric properties of the user's body. In an embodiment, theproximity sensor includes a contact sensor located at an exteriorsurface of the shell. In an embodiment, the proximity sensor includes animage sensor. In an embodiment, the proximity sensor includes atemperature sensor. In an embodiment, the proximity sensor includes anelectrical conductivity sensor. For example, an electrical conductivitysensor may include a pair of electrical contacts configured to beconductively bridged by contact with a fingertip or body part. In anembodiment, the proximity sensor includes a capacitive touch sensor. Forexample, one or more capacitive touch sensors may be located over theshell of a cell phone or tablet to have a chance of distinguishing aperson's hand from a handbag or pocket. In an embodiment, the proximitysensor includes a reverse power sensor configured to detect a loading ofa transmitting antenna of the portable electronic device by a body partof the user. For example, transmitters of portable electronic devicesgenerally have a reverse power sensor already present for protectionpurposes. In an embodiment, the proximity sensor includes a thermalcapacitor. A thermal capacitor would allow a transmitter of a portableelectronic device to run at full power if a user is near the edge of theportable electronic device for a while before you had to drop the callbecause the surface was getting too hot. An example implementation is aparaffin wax with the right melting point impregnated in a porous metalmatrix, inside of a metal can. In an embodiment, the proximity sensorincludes a heat flux sensor proximate to or incorporated in theheat-rejection element. This is expected to discern between a proximityof a hand of the user, or the portable electronic device being placed ina pocket.

In an embodiment, the thermal manager 250 is configured to select from alibrary of heat reduction strategies 252 a heat rejection strategy atleast partially based on the determined location of the user touch 249relative 245 to the location of the heat-rejection element 222, and toregulate heat transfer by the controllable thermal coupler 230 to theheat-rejection element in response to the selected heat reductionstrategy. In an embodiment, the thermal manager is configured to limitheat transfer by the controllable thermal coupler to the heat-rejectionelement in response to the determined location of the user touch. In anembodiment, the thermal manager is configured to limit heat transfer bythe controllable thermal coupler to the heat-rejection element inresponse to a determination that the location of the user touch relativeto the location of the heat-rejection element is within a zone 270 ofpossible heat discomfort. In an embodiment, the thermal manager isconfigured to limit heat discharged 223 by the heat-rejection element toa predetermined temperature in response to the determined location ofthe user touch relative to the location of the heat-rejection element.In an embodiment, the thermal manager is configured to limit heatdischarged 223 by the heat-rejection element to a predetermined airtemperature in response to the determined location of the user touchrelative to the location of the heat-rejection element. For example,this embodiment may be implemented by limiting a temperature of thecontrollable heat-rejection element within a zone of possible heatdiscomfort relative to the determined location of user touch. Forexample, the limiting a temperature may include limiting a temperatureof an exterior surface of the heat-rejection element or limiting atemperature of air expelled. In an embodiment, the thermal manager isconfigured to limit a surface temperature of the heat-rejection elementto a predetermined temperature in response to the determined location ofthe user touch relative to the heat-rejection element. In an embodiment,the predetermined temperature is a user tolerable temperature when thedetermined location of the user touch is within a zone of possible heatdiscomfort relative to the location of the heat-rejection element. Forexample, a user tolerable temperature may be 43° C. when the determinedlocation of the user touch is about 25 mm from the location of theheat-rejection element. In an embodiment, the predetermined temperatureis a user tolerable temperature based at least partially on a durationof the user touch within a zone of possible heat discomfort relative tothe location of the heat-rejection element. For example, a usertolerable temperature may be less than about 47° C. when the duration ofthe user touch is about several seconds, less than about 45° C. when theduration of the user touch is between about three and five minutes, andless than about 43° C. when the duration of the user touch is more thanabout five minutes. In an embodiment, the predetermined temperature islimited to a thermal damage constraint of the electronic device if thedetermined location of the user touch is not within a zone of possibleheat discomfort relative to the location of the heat-rejection element.For example, a thermal damage constraint of the electronic device mayinclude a thermal limit of a plastic shell 210, or a thermal limit ofthe heat-generating component 215. In an embodiment, the portableelectronic device further includes a temperature sensor 288 configuredto determine a temperature of the shell or of the heat-rejection element222. In an embodiment, the portable electronic device further includesanother proximity sensor 244.

FIG. 6 illustrates an example operational flow 600 implemented in aportable electronic device having a shell and heat-generating component.After a start operation, the operational flow includes a touch locationoperation 610. The touch location operation includes determining alocation of a user touch to the shell relative to a location of aheat-rejection element located at an exterior surface of the shell. Theheat-rejection element is configured to reject heat received from aheat-generating component of the electronic device into an environmentin thermal contact with the heat-rejection element. In an embodiment,the touch location operation may be implemented using the proximitysensor 242 described in conjunction with FIGS. 3 and 4. A choosingoperation 620 includes selecting a heat rejection strategy responsive tothe determined location of the user touch relative to the location ofthe heat-rejection element. The choosing operation may be implementedusing the thermal manager 250, and optionally the library ofheat-reduction strategies 252, described in conjunction with FIGS. 3 and4. A control operation 630 includes regulating heat transfer from theheat-generating component to the heat-rejection element in accordancewith the selected heat-rejection strategy. In an embodiment, the controloperation may be implemented using the controllable thermal coupler 230described in conjunction with FIGS. 3 and 4. The operational flowincludes an end operation.

In an embodiment of the touch location operation 610, the determiningincludes determining a location and duration of a user touch to theshell relative to a location of a heat-rejection element located at anexterior surface of the shell. In an embodiment of the choosingoperation 620, the selecting includes selecting a heat rejectionstrategy responsive to the determined location and a duration of theuser touch relative to the location of the heat-rejection element. Forexample, the heat rejection strategy may include reducing heat rejectionduring the duration of the user touch. In an embodiment of the touchlocation operation, the determining includes determining if a locationof a user touch to the shell relative to a location of a heat-rejectionelement located at an exterior surface of the shell is within a zone ofpossible heat discomfort. In an embodiment of the choosing operation620, the selecting includes selecting a heat rejection strategydecreasing heat rejection by the heat-rejection element if thedetermined location of the user touch relative to the location of theheat-rejection element is within a zone of possible heat discomfort. Inan embodiment, the zone of possible heat discomfort relative to thelocation of the heat-rejection element is less than about 25 mm. In anembodiment, the zone of possible heat discomfort relative to thelocation of the heat-rejection element is less than about 15 mm. In anembodiment, the zone of possible heat discomfort is in contact with theheat-rejection element.

In an embodiment of the choosing operation 620, the selecting includesselecting a heat rejection strategy increasing heat rejection by theheat-rejection element if the determined location of the user touchrelative to the location of the heat-rejection element is not within azone of possible heat discomfort. In an embodiment of the choosingoperation, the selecting includes selecting a heat rejection strategylimiting a surface temperature of the heat-rejection element to apredetermined temperature if the determined location of the user touchrelative to the location of the heat-rejection element is within a zoneof possible heat discomfort. For example, the predetermined temperaturemay include a temperature determined or predicted to be a user tolerabletemperature. For example, the predetermined temperature may include auser tolerable temperature.

FIG. 7 illustrates a portable electronic device having a system 700 forlimiting exterior temperatures encountered by a user of a portableelectronic device. The system includes means 710 for determining if alocation of a user touch to a shell of the portable electronic devicerelative to a location of a heat-rejection element located at anexterior surface of the shell is within a zone of possible heatdiscomfort. The heat-rejection element is configured to reject heatreceived from a heat-generating component of the portable electronicdevice into an environment in thermal contact with the heat-rejectionelement. The system includes means 720 for selecting a heat rejectionstrategy responsive to the determined location of the user touch withina zone of possible heat discomfort. The system includes means 730 forlimiting a heat transfer from the heat-generating component of theportable electronic device to the heat-rejection element in accordancewith the selected heat-rejection strategy.

FIG. 8 illustrates an example portable electronic device 805 having asystem for limiting exterior temperatures encountered by a user of theportable electronic device. In an embodiment, the portable electronicdevice may be implemented in the example operating environment 200described in conjunction with FIGS. 3 and 4. In an embodiment, theportable electronic device 805 may be implemented using the thincomputing device 20 described in conjunction with FIG. 1. In anembodiment, the portable electronic device may be implemented using thegeneral computing device 110 described in conjunction with FIG. 2. Theportable electronic device includes a shell 810 housing components ofthe portable electronic device 805 and a heat-generating component 815generating heat 816. In an embodiment, the shell includes ahand-holdable shell. The portable electronic device includes aheat-rejection element 822 located at an exterior surface 812 of theshell. The heat-rejection element is configured to reject heat 823received from the heat-generating component into the environment 298 inthermal contact with the heat-rejection element. In an embodiment, theheat-rejection element is substantially similar to the heat-rejectionelement 222 described in conjunction with FIGS. 3 and 4. For example,the environment may include an ambient environment or an externalenvironment in thermal contact with the heat-rejection element or theshell. The portable electronic device includes a controllable thermalcoupler 830 configured to regulate heat transfer 834 and 835 to theheat-rejection element. In an embodiment, the controllable thermalcoupler 830 configured to regulate heat transfer 834 and 835 between theheat collecting element 838 and the heat-rejection element.

In an embodiment, the controllable thermal coupler is substantiallysimilar to the controllable thermal coupler 230 described in conjunctionwith FIGS. 3 and 4. The portable electronic device includes an activitymonitor 860 configured to infer a user touch to the shell in response toa detected activity of the portable electronic device. In an embodiment,the detected activity may include an activity computationally detectedor an activity detected by a motion or movement of the shell. Forexample, a computationally detected activity may include receiving auser inputted phone number, or a search request. The portable electronicdevice includes a thermal manager 850 configured to regulate heattransfer by the controllable thermal coupler 830 to the heat-rejectionelement in response to the inferred user touch. In an embodiment, thecontrollable thermal coupler includes a control element 832 configuredto physically or mechanically accomplish the regulation of heattransfer, illustrated by heat 834 and heat 835 transferring or flowingfrom the heat-generating component to the heat-rejection element.

In an embodiment, the activity monitor 860 is further configured toinfer a location of the user touch to the shell 810 in response to adetected activity of the portable electronic device 805. In anembodiment, the location of the user touch may be computationallydetected or activity detected by a motion or movement of the shell. Inan embodiment, the heat-rejection element 822 includes a heat-rejectionelement located at or incorporated in an exterior surface 812 of theshell 810. In an embodiment, the detected activity of the portableelectronic device includes a detected user-initiated action executing onthe portable electronic device. For example, a detected user-initiatedaction may include a cell phone function active, a browser active,displaying video content, or a touch screen or keyboard receiving userinputs. In an embodiment, the detected activity of the portableelectronic device includes a detected spatial movement of the shellhaving a characteristic of a user-imparted movement. For example, adetected spatial movement may include a rotational or translationalmovement. For example, a detected spatial movement may include amovement characteristic of a hand holding the electronic device, amovement characteristic associated with the user viewing the device, ora movement characteristic associated with touch entries. For example,such characteristics may include dialing, or the portable electronicdevice remaining persisting in a substantially vertical or horizontalscreen orientation. In an embodiment, the detected activity of theportable electronic device includes a detected aspect of a movement ofthe shell having a characteristic of a user-imparted movement, i.e.indicative of keyboard activity compared to watching a video. In anembodiment, the detected activity of the portable electronic deviceincludes an accelerometer detected movement of the shell having acharacteristic of a user-imparted movement, such as being held orresting on a lap. In an embodiment, the detected activity of theportable electronic device includes the portable electronic device beingin a pocket mode state.

In an embodiment, the thermal manager 850 is configured to select from alibrary 852 of at least two heat-rejection strategies a heat rejectionstrategy responsive to an aspect of the inferred user touch. The thermalmanager is further configured to regulate heat transfer (834-835) by thecontrollable thermal coupler 830 to the heat-rejection element 822 inresponse to the selected heat reduction strategy. For example, thelibrary may include different strategies for regulating heat transferfor keyboard activity compared to watching a video. For example, thelibrary may include strategies for preferentially rejecting heat to theback side of the portable electronic device not undergoing user-impartedmovement.

FIG. 9 illustrates an example operational flow 900 implement in aportable electronic device having an exterior shell and aheat-generating component. After a start operation, the operational flowincludes a deduction operation 910. The deduction operation includesinferring a user touch to the shell in response to a detecteduser-initiated or user-imparted activity of the portable electronicdevice. In an embodiment, the deduction operation may be implementedusing the activity monitor 860 described in conjunction with FIG. 8. Acontrol operation 920 includes regulating a heat transfer from aheat-generating component of the portable electronic device to aheat-rejection element located at an exterior surface of the shell inresponse to the inferred user touch, the heat-rejection elementconfigured to reject heat into an environment external to the shell. Inan embodiment, the control operation may be implemented using thethermal manager 850 described in conjunction with FIG. 8. Theoperational flow includes an end operation.

In an embodiment of the control operation 920, the regulating heattransfer includes limiting a heat transfer from a heat-generatingcomponent of the portable electronic device to a heat-rejection elementlocated at an exterior surface of the shell in response to the inferreduser touch. In an embodiment, the operational flow may include at leastone additional operation, such as an operation 930. The operation 930includes selecting a heat rejection strategy responsive to the inferreduser touch to the shell. In an embodiment, the selecting includesselecting a heat rejection strategy responsive to a duration of theinferred user touch to the shell. In an embodiment, the controloperation 920 includes at least one additional operation, such as anoperation 922. The operation 922 includes regulating in accordance withthe selected heat-rejection strategy a heat transfer from aheat-generating component of the portable electronic device to aheat-rejection element located at an exterior surface of the shell.

FIG. 10 illustrates a portable electronic device having a system 1000for limiting exterior temperatures encountered by a user of the portableelectronic device. The system includes means 1010 for inferring a usertouch to the shell in response to a detected user-initiated oruser-imparted activity of the portable electronic device. The systemincludes means 1020 for selecting a heat rejection strategy responsiveto the inferred user touch to the shell. The system includes means 1030for regulating in accordance with the selected heat-rejection strategy aheat transfer from a heat-generating component of the portableelectronic device to a heat-rejection element located at an exteriorsurface of the shell.

FIG. 11 illustrates a portable electronic device 1105. The portableelectronic device 1105 is an alternative version of the portableelectronic device 205 operating in the environment 200 of FIGS. 3-5. Theportable electronic device 1105 of FIG. 11 includes a shell 1110 housingthe portable electronic device and a heat-generating component 1115generating heat 1116. The portable electronic device includes a firstheat-rejection element 1122 located at first exterior portion 1112 ofthe shell and a second heat-rejection element 1126 located at a secondexterior portion 1114 of the shell. Each heat-rejection element isconfigured to reject heat 1123 and heat 1127 received from theheat-generating component into an environment 298 in thermal contactwith the shell. The portable electronic device includes a controllablethermal coupler 1130 configured to regulate heat transfer to the firstheat-rejection element and/or to the second heat-rejection element. Inan embodiment, the controllable thermal coupler includes a controlelement 1132 configured to physically or mechanically accomplish theregulation of heat transfer, illustrated by heat 1134 and heat 1135transferring or flowing from the heat-generating component to theheat-rejection elements. The portable electronic device includes a firstproximity sensor 1142 configured to determine if a user touch 1149 tothe shell is within a first zone of possible heat discomfort 270(illustrated in FIG. 3) defined for the first heat-rejection element.The first proximity sensor has a first proximity 1143 to the firstheat-rejection element. The portable electronic device includes athermal manager 1150 configured to regulate heat transfer 1135A and1135B by the controllable thermal coupler respectively to the firstheat-rejection element and to second heat-rejection element. Theregulated heat transfer includes adjusting heat rejection away from thefirst heat-rejection element and toward the second heat-rejectionelement if the user touch is determined to be within the first zone ofpossible heat discomfort.

In an embodiment, the shell 1110 includes a hand-holdable shell. In anembodiment, the first heat-rejection element 1122 is located at a firstside of the first exterior portion 1112 of the shell and the secondheat-rejection element 1126 is located at a second side of a secondexterior portion 1114 of the shell. For example, a first exteriorportion may include a front, back, or one of the sides. The secondexterior portion would include an opposite side, or an adjacent side.Alternatively, the first heat-rejection element and the secondheat-rejection element may be spaced apart on a same side.

In an embodiment, the controllable thermal coupler 1130 includes acontrollable thermal coupler thermally coupled between theheat-generating component 1115 and (i) the first heat-rejection element1122 and (ii) the second heat-rejection element 1126. In an embodiment,the controllable thermal coupler includes a first heat receiving element1138 in thermal contact with the heat-generating component. In anembodiment, the controllable thermal coupler includes a second heatreceiving element (not illustrated) also in thermal contact with theheat-generating component.

In an embodiment, the portable electronic device 1105 further includes asecond proximity sensor 1146 configured to determine if a second usertouch to the shell 1110 is within a second zone of possible heatdiscomfort (not illustrated) defined for the second heat-rejectionelement 1126. The second proximity sensor has a proximity 1147 to thesecond heat-rejection element. In an embodiment, the regulated heattransfer includes adjusting heat rejection away from the firstheat-rejection element 1122 and toward the second heat-rejection element1126 if (i) the user touch is determined to be within the first zone ofpossible heat discomfort 270 and (ii) a second user touch is determinednot to be within the second zone of possible heat discomfort. In anembodiment, the regulated heat transfer includes decreasing heatrejection from the first heat-rejection element and increasing heatrejection from the second heat-rejection element. In an embodiment, theregulated heat transfer includes terminating heat rejection from thefirst heat-rejection element and increasing heat rejection from thesecond heat-rejection element. In an embodiment, the regulated heattransfer includes vectoring heat transfer away from first heat-rejectionelement and toward the second heat-rejection element. In an embodiment,the regulated heat transfer includes limiting rejection of heat by thefirst heat-rejection element to a predetermined temperature. Forexample, limiting rejection of heat may be by reference to an exteriorsurface of the first heat-rejection element or by reference to airdischarged by or touched by the first heat-rejection element. In anembodiment, the portable electronic device includes a temperature sensor1188 configured to determine an exterior temperature of a portion of theshell 1110. In an embodiment, the thermal manager 1150 includes alibrary of heat-reduction strategies 1152.

FIG. 12 illustrates an example operational flow 1200 limiting exteriortemperatures encountered by a user of a portable electronic devicehaving an exterior shell and a heat generating component. After a startoperation, the operational flow includes a touch assessment operation1210. The touch assessment operation includes determining if a usertouch to the shell is within a first zone of possible heat discomfortdefined for a first heat-rejection element. In an embodiment, the touchassessment operation may be implemented using the thermal manager 1150described in conjunction with FIG. 11. A choosing operation 1220includes selecting a heat rejection strategy responsive to adetermination that the user touch to the shell is within the first zoneof possible heat discomfort. The selected heat rejection strategyincludes adjusting heat rejection away from the first heat-rejectionelement and toward the second heat-rejection element. In an embodiment,the choosing operation may be implemented using the thermal manager1150, and optionally from among at least two heat-reduction strategiesof the library of heat-reduction strategies 1152, as described inconjunction with FIG. 11. A control operation 1230 includes regulatingheat transfer to the first heat-rejection element and to the secondheat-rejection element in response to the selected heat rejectionstrategy. In an embodiment, the control operation may be implementedusing the controllable thermal coupler 1130 described in conjunctionwith FIG. 11. The operational flow includes an end operation. The firstheat-rejection element is located at a first exterior portion of theshell. The second heat-rejection element located at a second exteriorportion of the shell. Each heat-rejection element is configured toreject heat received from the heat-generating component into anenvironment in thermal contact with the shell.

In an embodiment, the choosing operation 1220 includes selecting a heatrejection strategy responsive to (i) a determination that the user touchto the shell is within the first zone of possible heat discomfort and(ii) a duration of the user touch within the first zone of possible heatdiscomfort. In an embodiment, the control operation 1230 includesregulating heat transfer from the heat-generating device to the firstheat-rejection element and to second heat-rejection element. In anembodiment, the selecting includes selecting a heat regulating strategyvectoring heat transfer away from the first heat-rejection element andtoward the second heat-rejection element in response to the selectedheat rejection strategy. In an embodiment, the selecting includesselecting a heat regulating strategy limiting rejection of heat by thefirst heat-rejection element to a predetermined temperature.

FIG. 13 illustrates an example system 1300 for limiting exteriortemperatures encountered by a user of a portable electronic device. Thesystem includes means 1310 for determining if a user touch to a shell ofthe portable electronic device is within a first zone of possible heatdiscomfort defined for a first heat-rejection element of the portableelectronic device. The system includes means 1320 for selecting a heatrejection strategy responsive to a determination that the user touch tothe shell is within the first zone of possible heat discomfort. Theselected heat rejection strategy includes adjusting heat rejection awayfrom the first heat-rejection element and toward the secondheat-rejection element. The system includes means 1330 for regulatingheat transfer to the first heat-rejection element and to a secondheat-rejection element in response to the selected heat rejectionstrategy. The first heat-rejection element is located at a firstexterior portion of the shell, and the second heat-rejection element islocated at a second exterior portion of the shell. Each heat-rejectionelement is configured to reject heat received from the heat-generatingcomponent of the portable electronic device into an environment inthermal contact with the shell.

FIG. 14 illustrates an example environment 1400 in which embodiments maybe implemented. The environment includes an embodiment of a portableelectronic device 1405, and a user of the portable electronic device,illustrated as the person 290 having the hand 292 capable of touching,holding, or contacting the electronic device. FIG. 15 furtherillustrates a schematic view of the embodiment of the portableelectronic device 1405 of FIG. 14. This portion of the detaileddescription will employ both FIGS. 14 and 15 to describe of the portableelectronic device 1405.

The portable electronic device 1405 includes a system for limitingexterior temperatures encountered by the user 290 of the portableelectronic device. The portable electronic device includes a shell 1410housing a heat-generating component 1415. The portable electronic deviceincludes a contact sensor 1442 configured to determine a user touch 1449to the shell. For example, a finger or palm of the hand 292 of the user290 may contact or hold the shell of the portable electronic deviceduring use of the portable electronic device. The portable electronicdevice includes a temperature sensor 1488 configured to determine anexterior temperature of the shell. The portable electronic deviceincludes a thermal manager 1450 configured to reduce the exterior shelltemperature 1419 by regulating heat generation 1416 by theheat-generating component. The regulating heat generation is responsiveto the determined user touch and the determined temperature of theshell. In an embodiment, the portable electronic device 1405 may beimplemented using the thin computing device 20 described in conjunctionwith FIG. 1. In an embodiment, the portable electronic device may beimplemented using the general computing device 110 described inconjunction with FIG. 2.

In an embodiment, the thermal manager 1450 is configured to reduce theexterior shell temperature by limiting heat generation by theheat-generating component generation. In an embodiment, the shell 1410includes a hand-holdable shell. In an embodiment, the contact sensor1442 is configured to determine an occurrence of a user touch 1449 to anexterior portion 1412 of the shell 1410. In an embodiment, the contactsensor is configured to determine a location of a user touch to anexterior portion of the shell. In an embodiment, the temperature sensor1488 is configured to measure an exterior temperature of the shell. Inan embodiment, the temperature sensor is configured to predict anexterior temperature of the shell. For example, a prediction may bebased on estimates or history of heat generation by the heat-generatingcomponent. For example, a prediction may be based on an interiortemperature of the portable electronic device. For example, a predictionmay be based on correlations (i.e., made by the manufacturer or atesting facility) between levels of heat generation or interiortemperatures with external temperatures at various locations on theshell. In an embodiment, the temperature sensor is configured to measurea temperature of a first exterior portion of the shell. In anembodiment, the temperature sensor is configured to determine atemperature of the shell substantially concurrent with the determinedoccurrence of the user touch to the shell. For example, substantiallyconcurrent may include happening at about the same time, i.e., withinabout one second, five seconds, ten seconds, or one minute. In anembodiment, the temperature sensor is configured to determine atemperature of a same outside portion of the shell as the user touch tothe shell. In an embodiment, the temperature sensor is configured todetermine a temperature of the shell within about 2 cm of a determinedlocation of the user touch to the shell. In an embodiment, thetemperature sensor is configured to determine a temperature of the shellwithin about 1 cm of a determined location of the user touch to theshell. In an embodiment, the contact sensor is further configured todetermine a duration of a user touch to the shell. In an embodiment, theshell includes another exterior portion 1414 and a display screen 1486.

In an embodiment, the thermal manager 1450 includes a thermal managerconfigured to regulate heat generation 1416 by the heat-generatingcomponent 1415 in response to (i) the determined user touch 1449 and(ii) the determined temperature of the shell exceeding a thresholdvalue. In an embodiment, the thermal manager includes a thermal managerconfigured to regulate heat generation by the heat-generating componentin response to (i) a location of the determined user touch, and (ii) ameasured temperature of the shell exceeding a threshold value. In anembodiment, the thermal manager includes a thermal manager configured toregulate heat generation by the heat-generating component in response to(i) the determined user touch, (ii) a duration of the user touch, and(iii) the determined temperature of the shell exceeding a thresholdvalue. In an embodiment, the thermal manager includes a thermal managerconfigured to limit heat generation by initiating a slowdown in a clockspeed of a processor of the portable electronic device in response tothe determined user touch. For example, a slowdown in clock speed of aprocessor may be implemented by a component controller 1470 incommunication with the thermal manager. In an embodiment, the thermalmanager includes a thermal manager configured to limit heat generationby initiating a slowdown in clock speed of a processor of the portableelectronic device in response to the determined user touch and inresponse to a measured temperature of a first external portion of theshell exceeding a threshold value. In an embodiment, the thermal managerincludes a thermal manager configured to regulate heat generation byterminating, delaying, or slowing down execution of an application orprocess. In an embodiment, the thermal manager includes a thermalmanager configured to regulate heat generation by terminating, delaying,or slowing down execution of an application or process drawing currentfrom an energy storage device, such as a battery, of the portableelectronic device greater than a current limitation. For example, thecurrent limitation may be a predetermined limitation, or a dynamicallydetermined limitation based on factors related to an aspect of theelectronic device, the particular application, or the particular processinvolved. For example, different current limitations may be selected inresponse to high display demands, or high storage media or volatilemedia activity. In an embodiment, the thermal manager includes a thermalmanager configured to limit heat generation by reducing a core voltageof a processor of the portable electronic device in response to thedetermined user touch. In an embodiment, the thermal manager includes athermal manager configured to select from a library of heat-rejectionstrategies a heat rejection strategy responsive to the exteriortemperature of the shell, and to regulate heat generation by theheat-generating component in response to the selected heat rejectionstrategy.

FIG. 16 illustrates an example operational flow 1500 implemented in aportable electronic device having an exterior shell and aheat-generating component. After a start operation, the operational flowincludes a recognition operation 1510. The recognition operationincludes sensing a user touch to an exterior surface of the shell. In anembodiment, the recognition operation may be implemented using thecontact sensor 1442 described in conjunction with FIGS. 13 and 14. Anevaluating operation 1520 includes determining a temperature of theshell substantially concurrent with the user touch to the shell. In anembodiment, the evaluating operation may be implemented using thetemperature sensor 1488, and optionally the thermal manager 1450,described in conjunction with FIGS. 13 and 14. In an embodiment, theevaluating operation may be implemented by a prediction of the shelltemperature (e.g., based on values of heat generation or interiortemperatures). A choosing operation 1530 includes selecting a heatreduction strategy responsive to the sensed user touch and thedetermined temperature of the shell. In an embodiment, the choosingoperation may be implemented using the thermal manager 1450 described inconjunction with FIGS. 13 and 14. A control operation 1540 includeslimiting heat generation by a heat-generating component of theelectronic device in response to the selected heat reduction strategy.In an embodiment, the control operation may be implemented using thethermal manager 1450, and optionally the component controller 1470,described in conjunction with FIGS. 13 and 14. The operational flowincludes an end operation.

Returning to FIGS. 14 and 15, an example alternative embodiment of theportable electronic device 1405 is also illustrated by these figures.The portable electronic device 1405 includes a system for limitingexterior shell temperatures encountered by a user. The portableelectronic device includes the shell 1410 housing the portableelectronic device and the heat-generating component 1415. The portableelectronic device includes a temperature sensor 1488 configured tomeasure a temperature of an external portion 1412 of the shell. Theportable electronic device includes a thermal manager 1450 configured tolimit heat generation 1416 by the heat-generating component in responseto the measured temperature of the shell.

In an embodiment, the shell 1410 includes a hand-holdable shell housingthe portable electronic device 1405. In an embodiment, the thermalmanager 1450 includes a thermal manager configured to limit heatgeneration 1416 by the heat-generating component 1415 in response to ameasured temperature of the shell exceeding a threshold value. In anembodiment, the thermal manager includes a thermal manager configured tolimit heat generation by slowing down a clock speed of a processor ofthe portable electronic device in response to the measured temperatureof the shell. In an embodiment, the thermal manager includes a thermalmanager configured to limit heat generation by terminating, delaying, orslowing down execution of an application or process in response to themeasured temperature of the shell. In an embodiment, the thermal managerincludes a thermal manager configured to limit heat generation byterminating, delaying, or slowing down execution of an application orprocess drawing current from an energy storage device of the portableelectronic device greater than a current limit. In an embodiment, thethermal manager includes a thermal manager configured to limit heatgeneration by reducing a core voltage of a processor of the portableelectronic device in response to the measured temperature of the shell.

FIG. 17 illustrates an example operational flow 1600 implemented in aportable electronic device having a shell and a heat-generatingcomponent. After a start operation, the operational flow includes anevaluation operation 1610. The evaluating operation includes measuring atemperature of the shell. In an embodiment, the evaluating operation maybe implemented using the temperature sensor 1488, and optionally thethermal manager 1450, described in conjunction with FIGS. 13 and 14. Achoosing operation 1620 includes selecting a heat reduction strategyresponsive to the measured temperature of the shell. In an embodiment,the choosing operation may be implemented using the thermal manager 1450described in conjunction with FIGS. 13 and 14. A control operation 1630includes limiting a heating generation by a heat-generating component ofthe electronic device in response to the selected heat reductionstrategy. In an embodiment, the control operation may be implementedusing the thermal manager 1450, and optionally the component controller1470, described in conjunction with FIGS. 13 and 14. The operationalflow includes an end operation.

In an embodiment of the evaluating operation 1620, the measuringincludes measuring a temperature of an exterior surface of the shell. Inan embodiment of the choosing operation 1630, the selecting a heatreduction strategy includes selecting the heat-generating component tobe regulated by the heat reduction strategy from among at least twopossible heat-generating components of the portable electronic device.In an embodiment, a heat-generating component includes a heat-generatingcomponent configured to be directly or indirectly limited in its heatgeneration. In an embodiment, the selecting a heat reduction strategyincludes selecting a heat-reduction strategy limiting an exteriorsurface temperature of the shell to a predetermined temperature. In anembodiment, the selecting a heat reduction strategy includes selecting aheat-reduction strategy slowing down a clock speed of a processor of theportable electronic device in response to the measured temperature ofthe shell. In an embodiment, the selecting a heat reduction strategyincludes selecting a heat-reduction strategy terminating, delaying, orslowing down execution of an application or process in response to themeasured temperature of the shell. In an embodiment, the selecting aheat reduction strategy includes selecting a heat-reduction strategyreducing a core voltage of a processor of the portable electronic devicein response to the measured temperature of the shell. In an embodiment,the selecting a heat reduction strategy includes selecting a heatreduction strategy from a library 1452 of at least two heat-reductionstrategies.

All references cited herein are hereby incorporated by reference intheir entirety or to the extent their subject matter is not otherwiseinconsistent herewith.

In some embodiments, “configured” includes at least one of designed, setup, shaped, implemented, constructed, or adapted for at least one of aparticular purpose, application, or function.

It will be understood that, in general, terms used herein, andespecially in the appended claims, are generally intended as “open”terms. For example, the term “including” should be interpreted as“including but not limited to.” For example, the term “having” should beinterpreted as “having at least.” For example, the term “has” should beinterpreted as “having at least.” For example, the term “includes”should be interpreted as “includes but is not limited to,” etc. It willbe further understood that if a specific number of an introduced claimrecitation is intended, such an intent will be explicitly recited in theclaim, and in the absence of such recitation no such intent is present.For example, as an aid to understanding, the following appended claimsmay contain usage of introductory phrases such as “at least one” or “oneor more” to introduce claim recitations. However, the use of suchphrases should not be construed to imply that the introduction of aclaim recitation by the indefinite articles “a” or “an” limits anyparticular claim containing such introduced claim recitation toinventions containing only one such recitation, even when the same claimincludes the introductory phrases “one or more” or “at least one” andindefinite articles such as “a” or “an” (e.g., “a receiver” shouldtypically be interpreted to mean “at least one receiver”); the sameholds true for the use of definite articles used to introduce claimrecitations. In addition, even if a specific number of an introducedclaim recitation is explicitly recited, it will be recognized that suchrecitation should typically be interpreted to mean at least the recitednumber (e.g., the bare recitation of “at least two chambers,” or “aplurality of chambers,” without other modifiers, typically means atleast two chambers).

In those instances where a phrase such as “at least one of A, B, and C,”“at least one of A, B, or C,” or “an [item] selected from the groupconsisting of A, B, and C,” is used, in general such a construction isintended to be disjunctive (e.g., any of these phrases would include butnot be limited to systems that have A alone, B alone, C alone, A and Btogether, A and C together, B and C together, or A, B, and C together,and may further include more than one of A, B, or C, such as A₁, A₂, andC together, A, B₁, B₂, C₁, and C₂ together, or B₁ and B₂ together). Itwill be further understood that virtually any disjunctive word or phrasepresenting two or more alternative terms, whether in the description,claims, or drawings, should be understood to contemplate thepossibilities of including one of the terms, either of the terms, orboth terms. For example, the phrase “A or B” will be understood toinclude the possibilities of “A” or “B” or “A and B.”

The herein described aspects depict different components containedwithin, or connected with, different other components. It is to beunderstood that such depicted architectures are merely examples, andthat in fact many other architectures can be implemented which achievethe same functionality. In a conceptual sense, any arrangement ofcomponents to achieve the same functionality is effectively “associated”such that the desired functionality is achieved. Hence, any twocomponents herein combined to achieve a particular functionality can beseen as “associated with” each other such that the desired functionalityis achieved, irrespective of architectures or intermedial components.Likewise, any two components so associated can also be viewed as being“operably connected,” or “operably coupled,” to each other to achievethe desired functionality. Any two components capable of being soassociated can also be viewed as being “operably couplable” to eachother to achieve the desired functionality. Specific examples ofoperably couplable include but are not limited to physically mateable orphysically interacting components or wirelessly interactable orwirelessly interacting components.

With respect to the appended claims the recited operations therein maygenerally be performed in any order. Also, although various operationalflows are presented in a sequence(s), it should be understood that thevarious operations may be performed in other orders than those which areillustrated, or may be performed concurrently. Examples of suchalternate orderings may include overlapping, interleaved, interrupted,reordered, incremental, preparatory, supplemental, simultaneous,reverse, or other variant orderings, unless context dictates otherwise.Use of “Start,” “End,” “Stop,” or the like blocks in the block diagramsis not intended to indicate a limitation on the beginning or end of anyoperations or functions in the diagram. Such flowcharts or diagrams maybe incorporated into other flowcharts or diagrams where additionalfunctions are performed before or after the functions shown in thediagrams of this application. Furthermore, terms like “responsive to,”“related to,” or other past-tense adjectives are generally not intendedto exclude such variants, unless context dictates otherwise.

While various aspects and embodiments have been disclosed herein, otheraspects and embodiments will be apparent to those skilled in the art.The various aspects and embodiments disclosed herein are for purposes ofillustration and are not intended to be limiting, with the true scopeand spirit being indicated by the following claims.

What is claimed is: 1.-76. (canceled)
 77. A method of limiting exteriortemperatures encountered by a user of a portable electronic devicehoused by a shell, the method comprising: determining a location of auser touch to the shell relative to a location of a heat-rejectionelement located at an exterior surface of the shell, the heat-rejectionelement configured to reject heat received from a heat-generatingcomponent of the electronic device into an environment in thermalcontact with the heat-rejection element; selecting a heat rejectionstrategy responsive to the determined location of the user touchrelative to the location of the heat-rejection element; and regulatingheat transfer from the heat-generating component to the heat-rejectionelement in accordance with the selected heat-rejection strategy.
 78. Themethod of claim 77, wherein the determining includes determining alocation and duration of a user touch to the shell relative to alocation of a heat-rejection element located at an exterior surface ofthe shell.
 79. The method of claim 78, wherein the selecting includesselecting a heat rejection strategy responsive to the determinedlocation and duration of the user touch relative to the location of theheat-rejection element.
 80. The method of claim 77, wherein thedetermining includes determining if a location of a user touch to theshell relative to a location of a heat-rejection element located at anexterior surface of the shell is within a zone of possible heatdiscomfort.
 81. The method of claim 77, wherein the selecting includesselecting a heat rejection strategy decreasing heat rejection by theheat-rejection element if the determined location of the user touchrelative to the location of the heat-rejection element is within a zoneof possible heat discomfort.
 82. The method of claim 81, wherein thezone of possible heat discomfort relative to the location of theheat-rejection element is less than about 25 mm.
 83. The method of claim81, wherein the zone of possible heat discomfort relative to thelocation of the heat-rejection element is less than about 15 mm.
 84. Themethod of claim 81, wherein the zone of possible heat discomfort is incontact with the heat-rejection element.
 85. The method of claim 77,wherein the selecting includes selecting a heat rejection strategyincreasing heat rejection by the heat-rejection element if thedetermined location of the user touch relative to the location of theheat-rejection element is not within a zone of possible heat discomfort.86. The method of claim 85, wherein the selecting includes selecting aheat rejection strategy limiting a surface temperature of theheat-rejection element to a predetermined temperature if the determinedlocation of the user touch relative to the location of theheat-rejection element is within a zone of possible heat discomfort. 87.A system for limiting exterior temperatures encountered by a user of aportable electronic device, the system comprising: means for determiningif a location of a user touch to a shell of the portable electronicdevice relative to a location of a heat-rejection element located at anexterior surface of the shell is within a zone of possible heatdiscomfort, the heat-rejection element configured to reject heatreceived from a heat-generating component of the portable electronicdevice into an environment in thermal contact with the heat-rejectionelement; means for selecting a heat rejection strategy responsive to thedetermined location of the user touch within a zone of possible heatdiscomfort; and means for limiting a heat transfer from theheat-generating component of the portable electronic device to theheat-rejection element in accordance with the selected heat-rejectionstrategy.